Liquid Mental cooling device for CPU made its debut at the 9th China International Digital Content Expo. （ Image by TIPCCAS )

Liquid Mental cooling device for CPU made its debut at the 9th China International Digital Content Expo., Beijing, Oct. 28-31, 2011, which is a prelude to its marketization in November.

Such novel thermal management device, which adopting the liquid metal as the coolant, was co-developed by the Technical Institute of Physics and Chemistry, Chinese Academy of Sciences  (TIPCCAS) and Beijing EMIKON Tech.Development Co.,Ltd.

It is specially designed for the high-power CPU. Compared with the traditional thermal management method, such as air cooling, water cooling, and heat pipe, Liquid Mental cooling method has been demonstrated with several significant advantages. It possessed perfect thermal performance, lower thermal resistance and less noise. It can be widely applied in high-performance computer, computer server and database center. The official product is launching in November.

In 2002, the liquid metal was first introduced to the computer thermal management by researchers in TIPCCAS. Years of research work on liquid metal not only realized series of breakthroughs, developed several application fields, but also established the full intellectual property system for such individual thermal management method.