The paper “Design of practical liquid metal cooling device for heat dissipation of high performance CPUs” was reputed as 2010 Best Paper of ASME Journal of Electronic Packaging.

The paper was written by Ph.D. DENG Yueguang and his supervisor Prof. LIU Jing from Technical Institute of Physics and Chemistry, Chinese Academy of Sciences (TIPC). This is a great accomplishment not only because this award is, for the fist time, issued to researchers of Chinese Mainland, but also it is only given once a year and is openly competed for by all of the submitted papers for that year.

With the increasing power density of computer CPU and other electronic devices, the traditional cooling methods including heat pipe, water and wind cooling began to show insufficient cooling capacity, preventing their large scope commercialization and utilization.

In order to achieve a breakthrough in resolving the issue of thermal management, a research group headed by Prof. LIU Jing from TIPC brought about the liquid metal cooling in 2002, a novel and effective heat dissipation method due to the superior thermal physical properties and the unique electromagnetic-driven characteristic of liquid metal.

The mental liquid of GaInSn alloy with the melting point of around 10°C was used as the coolant and two typical protypes were fabricated to evaluate the cooling performance of the liquid metal cooling device. The thermal resistance could be as low as 0.13°C/W. Characterized by energy saving, stability, durability, low thermal resistance, and capability to cope with extremely high heat flux, it enjoys a promising application in a variety of fields.